德律TR7700SIIIPlus介绍:
TR7700 SIII Plus结合了先进的高精度摄像系统和TRI独有的多相位光源,可捕捉到全尺寸PCB板前所未有的细致影像。新一代检测软件结合了优秀的缺陷检测和简易型自动CAD编程,为AOI检测解决方案提供当代最顶尖的技术水准。
德律TR7700SIIIPlus特性:
1.备有多相位光源的高精准度AOI
2. 全新图形用户界面提供简易离线编程
3. 智能化自动输送带系统大幅度降低加载时间
4.新式色彩空间演算法,可提高正确度并减少误判
德律TR7700SIIIPlus规格:
Optical System
Imaging Method | Dynamic Imaging |
Top Camera | 4 Mpix |
Angle Camera | N/A |
Imaging Resolution | 10 µm, 15 µm (factory setting) |
Lighting | Multi-phase RGB+W LED |
3D Technology | Single/Dual 3D laser sensors (optional) |
Max. 3D Range | 20 mm (with 3D Laser Sensor upgrade optional) |
Inspection Performance
Imaging Speed | 4 Mpix@ 10 µm 2D: 60 cm²/sec 4 Mpix@ 15 µm 2D: 120 cm²/sec 4 Mpix@ 10 µm 2D+3D (optional): 27-39 cm²/sec 4 Mpix@ 15 µm 2D+3D (optional): 40-60 cm²/sec Note: Depending on board size and laser resolution |
Motion Table & Control
X-Axis Control | Ballscrew + AC-servo controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | N/A |
X-Y Axis Resolution | 1 µm |
Board Handling
Max PCB Size | TR7700M SIII: 330 x 280 mm TR7700 SIII Plus: 510 x 460 mm TR7700L SIII: 660 x 610 mm TR7700 SIII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 25 mm [48 mm optional] |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm [5 mm optional] |
Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
Inspection Functions
Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material |
Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
Dimensions
WxDxH | TR7700M SIII: 850 x 1250 x 1500 mm TR7700 SIII Plus: 1100 x 1670 x 1550 mm TR7700L SIII: 1300 x 1635 x 1655 mm TR7700 SIII DL: 1100 x 1670 x 1550 mm Note: not including signal tower, signal tower height 520 mm |
Weight | TR7700M SIII: 760 kg TR7700 SIII Plus: 1080 kg TR7700L SIII: 1240 kg TR7700 SIII DL: 1150 kg |