德律TR7700QE介绍:
TR7700QE AOI 藉由结合以四向可调变数位条纹光投影为基础的新世代2D和3D技术,提供了优越的3D锡点和元件组装检测功能。最新的检测软体采用快速CAD资料的编程及高度可客制化模板。
德律TR7700QE特性:
1.优越的2D+3D检测覆盖率
2. 四向数位条纹光投影
3. 3D高度检测范围可高达40 mm
4. 高速CoaXPress取像
5.可选配3D雷射模组
德律TR7700QE规格:
Optical System
Imaging Method | Stop-and-Go Imaging |
Top Camera | 12 Mpix |
Angle Camera | N/A |
Imaging Resolution | 10 µm, 15 µm (factory setting) |
Lighting | Multi-phase true color LED, Coaxial lighting |
3D Technology | Quad Digital Fringe Projectors |
Max. 3D Range | 12 Mpix@ 10 µm: 0-10 mm 12 Mpix@ 15 µm: 0-40 mm* * Requires GPU card upgrade. The default 3D height is 0 – 20mm |
Inspection Performance
Imaging Speed | 12 Mpix@ 10 µm: 13.5 cm²/sec 12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress 12 Mpix@ 15 µm: 30 cm²/sec 12 Mpix@ 15 µm: 50 cm²/sec with optional CoaXPress Note: Depending on component distribution |
Motion Table & Control
X-Axis Control | Ballscrew + AC-servo controller (Linear motor optional) |
Y-Axis Control | Dual driven ballscrew + AC-servo controller |
Z-Axis Control | Ballscrew + AC-servo controller (optional) |
X-Y Axis Resolution | 1 µm |
Board Handling
Max PCB Size | TR7700QE: 510 x 460 mm TR7700L QE: 660 x 610 mm TR7700QE DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 50 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm [5 mm optional] |
Conveyor | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
Inspection Functions
Component | Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
Solder | Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |