德律TR7500SIII介绍:
TRI顶尖的在线型AOI解决方案,提供超高速五支相机镜头的组装电路板检测,具有可靠的缺陷检测功能,即使是最复杂的焊点以及组装缺陷皆能检出。TR7500 SIII搭载智能化软件和高性能硬体的强大组合,提供可靠且易于使用的AOI解决方案,更致力于集中在高精度的检测结果并将誤判降到最低,以帮助优化您的生产产量。
德律TR7500SIII特性:
1. 高精度五支镜头的多相AOI
2. 智能编程的GUI与离线编辑功能
3. 智能化自动输送带系统可减少进出板时间
4. 检测可靠,高精度,低误判
德律TR7500SIII规格:
Optical System
Imaging Method | Dynamic Imaging |
Top Camera | 4 Mpix |
Angle Camera | 1.3 Mpix or 6.5 Mpix (factory setting) |
Imaging Resolution | 10 µm, 15 µm (factory setting) |
Lighting | Multi-phase RGB+W LED |
3D Technology | Single/Dual 3D laser sensors |
Max. 3D Range | 20 mm (with 3D Laser Sensor upgrade optional) |
Inspection Performance
Imaging Speed | 4 Mpix@ 10 µm 2D: 60 cm²/sec 4 Mpix@ 15 µm 2D: 120 cm²/sec |
Motion Table & Control
X-Axis Control | Ballscrew + AC-servo controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | N/A |
X-Y Axis Resolution | 1 µm |
Board Handling
Max PCB Size | TR7500 SIII: 510 x 460 mm TR7500L SIII: 660 x 610 mm TR7500 SIII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 25 mm [48 mm optional] |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm [5 mm optional] |
Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
Inspection Functions
Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
Dimensions
WxDxH | TR7500 SIII: 1100 x 1670 x 1550 mm TR7500L SIII: 1300 x 1630 x 1655 mm TR7500 SIII DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm |
Weight | TR7500 SIII: 1030 kg TR7500L SIII: 1255 kg TR7500 SIII DL: 1150 kg |