德律TR7500SII介绍:
结合大FOV之上视3-CCD彩色相机及四个倾斜角度相机以优化测试涵盖率,比TR7500检测速度快两倍以上。搭配多区域且高弹性的RGB+W彩色光源系统,配合低角度的光源设计,可提供极性及黑色元器件更好的检测方案,并且可针对无铅和传统组装电路板上的微小元件01005及提供更精准稳定的检测能力。
德律TR7500SII特性:
1.高速与多角度影像的在线彩色自动光学检测
2.大尺寸相机可针对微小元件01005做检测
3.性价比高的高测试涵盖率AOI解决方案
德律TR7500SII规格:
Optical System
Imaging Method | Dynamic Imaging |
Top Camera | XGA 3CCD color camera, FOV image size (1536 x 2048 pixel) |
Angle Camera | XGA mono camera, FOV image size (1536 x 2048 pixel) |
Imaging Resolution | 10 µm, 12 µm, 15 µm (factory setting) |
Lighting | Multi-segment, multi-angle RGB LED (coaxial lighting optional) |
3D Technology | N/A |
Max. 3D Range | N/A |
Inspection Performance
Imaging Speed | 10 µm: 44 cm²/sec 12 µm: 69 cm²/sec 15 µm: 93 cm²/sec |
Motion Table & Control
X-Axis Control | 伺服 马达搭配DSP运动控制系统 |
Y-Axis Control | 伺服 马达搭配DSP运动控制系统 |
Z-Axis Control | N/A |
X-Y Axis Resolution | 1 µm |
Board Handling
Max PCB Size | TR7500 SII: 510 x 460 mm TR7500L SII: 660 x 610 mm |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | TR7500 SII: 3 kg (5 kg optional) TR7500L SII: 5 kg (8 kg optional) |
Top Clearance | 40 mm |
Bottom Clearance | 40 mm |
Edge Clearance | TR7500 SII: 3.5 mm TR7500L SII: 3 mm |
Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
Inspection Functions
Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Lifted Component |
Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |