TR7007D Plus 3D SPI平台配备了优化的运动控制系统(EtherCat)和高阶的2D照明模组,可以准确地检测低锡桥缺陷及进行板弯补偿以消除PCB制程误差。 TR7007D Plus具有2组数位条纹光投影,以确保进行无阴影检测。 SPI解决方案简化了生产线和MES之间的数据交换流程,实现生产线连接数据的可追溯性。
德律TR7007DPLUS特性
• 强化2D照明,提供更佳的检测一致性
• 实时量测新型运动控制系统EtherCat
• SPC数据实时追踪智能工厂解决方案
• 闭环(Closed Loop)反馈和前馈功能
德律TR7007D PLUS规格
Optical System
Imaging Method | Stop-and-Go Imaging |
Camera | 4 Mpix |
Imaging Resolution | 10 μm , 15 µm (factory setting) |
Lighting | Enhanced 2D Lights (RGB+W) |
3D Technology | 2-way Digital Fringe Pattern |
Field of View | 20x20 mm |
Inspection Performance
Imaging Speed | Up to 3 FOV/sec |
Height Resolution | 0.45 μm |
Max. Solder Height | 420 μm/840 μm |
Motion Table & Control
X-Axis Control | Ballscrew + EtherCAT motion controller |
Y-Axis Control | Ballscrew + EtherCAT motion controller |
Z-Axis Control | N/A |
X-Y Axis Resolution | 0.5 μm |
Z-Axis Resolution | N/A |
Board Handling
Max PCB Size | TR7007D Plus: 510 x 460 mm TR7007D Plus DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
PCB Thickness | 0.6 - 5mm |
Max PCB Weight | 3kg. Optional: 5kg |
Top Clearance | 50 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm |
Conveyor Height | 880 – 920 mm * SMEMA Compatible |
Inspection Functions
Defects | Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
Measurement | Height Area Volume Offset |
Dimensions
WxDxH | TR7007D Plus: 1000 x 1400 x 1650 mm TR7007D Plus DL: 1000 x 1500 x 1650 mm Note: not including signal tower, signal tower height 515 mm |
Weight | TR7007D Plus: 750 kg TR7007D Plus DL: 830 kg |